| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 0-519024-2 0-519151-9 2-539787-1 1-519151-3 |
ERGOCRIMP Die Set for Mini Mic Rec. and Tab
|
Tyco Electronics
|
| 9-0744506-3 C-1-528041-5 |
DIE SET SHIELD CRIMP)HVP800 90DEG. 25 SQMM
|
TE Connectivity Ltd
|
| ACTS74HMSR-02 |
Dual D Type Flip Flop with Set and Reset, Advanced Logic, CMOS; Temperature Range: -55°C to 125°C; Package: Die (Military Visual) ACT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, UUC14
|
Intersil, Corp.
|
| AX101071 |
Modular Connectors - CAT6 Modular Jack - MDVO style
|
List of Unclassifed Man...
|
| AX101325 |
Modular Connectors - CAT6 Modular Jack - KeyConnect
|
List of Unclassifed Man...
|
| AX101316 |
Modular Connectors - CAT5E Modular Jack - KeyConnect
|
List of Unclassifed Man...
|
| AX101323 |
Modular Connectors - CAT6 Modular Jack - KeyConnect
|
List of Unclassifed Man...
|
| MC74VHCT574A MC74VHCT74A ON1761 MC74VHCT74AD MC74V |
From old datasheet system
Dual D-Type Flip-Flop with Set and Reset
OCTAL D-TYPE FLLP-FLOP WITH SET AND RESET
|
ON Semiconductor
Motorola
|
| 0380520000 |
Modular Terminal; Wire Size (AWG):8; Mounting Type:Clipped; Current Rating:36A; Series:Sak Series; Width:8mm RoHS Compliant: Yes 47 A, MODULAR TERMINAL BLOCK, 1 ROW, 1 DECK
|
Weidmuller, Corp.
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
